-20%
Key Features:
- Moderate Melting Point: 183°C, ideal for various electronic components and soldering tasks.
- Lead-Free: Environmentally friendly and compliant with RoHS standards.
- Excellent Solderability: Provides strong, reliable solder joints with minimal defects.
- Wide Application: Suitable for BGA, PGA, CSP packages, and flip chip operations.
- No-Clean Formula: Reduces the need for post-solder cleaning, saving time and effort.
- Volume: 50g per bottle, offering ample material for multiple projects.
