MiJing 217A Lead-free High Temperature Solder Tin Paste Medium and Welding Flux Soldering Paste Repair for Phone
MiJing 217A Lead-free High Temperature Solder Tin Paste Medium and Welding Flux Soldering Paste Repair for Phone Original price was: ₹399.00.Current price is: ₹289.00.
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YCS 183 Degree PPD Solder Paste For Mobile Phone PCB BGA CPU Welding repairs
YCS 183 Degree PPD Solder Paste For Mobile Phone PCB BGA CPU Welding repairs Original price was: ₹379.00.Current price is: ₹329.00.

MiJing 190A Lead-free High Temperature Solder Tin Paste Medium and Welding Flux Soldering Paste Repair for Phone

Original price was: ₹399.00.Current price is: ₹289.00.

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Features & Compatibility

Product Description

MJ-190A 35g Mijing BGA solder paste 190C tin paste Contains silver paste for Phone motherboard CPU NAND BGA reballing tools

Additional information

Weight 0.035 kg