Melting point ~183 °C Specifically formulated as a Sn63/Pb37 alloy, it melts cleanly at ~183 °C — ideal for accurate reflow on small components.
High‑purity tin alloy Designed for minimized contaminants and oxidation, offering reliable solder joints and reduced residue.
Superior conductivity & wettability Ensures quick, consistent spreading over pads and leads to robust electrical connections.
Low residue after soldering Leaves minimal flux residue, reducing cleanup time and risk of shorts .
Strong adhesion (tackiness) Holds SMD/BGA components in place during the heating process—crucial for precise alignment