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Relife HW-21 183?C PPD Paste 40G
RELIFE HW-21 183°C PPD Paste 40G – Precision No-Clean Solder Paste for BGA & Electronics Repair
Unlock professional-grade soldering performance with the Relife HW-21 183°C PPD Paste 40G, designed for technicians who demand accuracy, reliability, and convenience. Whether you’re reworking BGA chips, repairing mobile motherboards, or maintaining digital devices, this solder paste delivers smooth, clean, and strong joints with zero hassle.
Medium Temperature, Maximum Precision
The HW-21 features a low melting point of 183°C, perfect for delicate PCBs and high-density components. Its stable Sn63/Pb67 alloy ensures quick heat flow and strong conductivity, making it ideal for mobile phone chip-level soldering, SMD repairs, and computer circuit work.
No-Clean, No Mess
Thanks to its no-clean formula, there’s no need for post-soldering cleanup. This saves time and eliminates the risk of damaging sensitive parts, ensuring a smooth workflow in every session.
Trusted for BGA & Fine Work
Engineered with ultra-fine particles (20–38 microns), this Relife HW-21 183°C PPD Paste offers superior spreadability and bonding. It supports accurate application even on the smallest BGA pads, making it a favorite among micro-soldering professionals.
