YCS H03 Mainboard Repair Fixture for BGA CPU IC Soldering and Glue Removal

YCS H03 Universal PCB Fixture for BGA CPU IC Soldering & Glue/Tin Removal Clamp Tool

The YCS H03 Mainboard Repair Fixture is a precision clamp tool designed for BGA, CPU, and IC chip soldering or removal. Its compact structure holds the motherboard firmly, aiding in accurate tin removal, mini glue repair, and rework tasks on mobile logic boards.

Features:

• Model: YCS H03
• Application: Mainboard CPU/IC/BGA chip repair
• Use: Clamp for soldering, tin removal, reballing
• Material: High-quality aluminum alloy
• Design: Non-slip base with adjustable arms
• Compatibility: Universal for most phone logic boards
• Size: Compact, portable, heat-resistant
• Stability: Strong grip, anti-shake for precision work

Benefits:

• Holds mainboard securely during repairs
• Increases reballing and soldering accuracy
• Lightweight, ideal for technician workstations
• Prevents damage during glue or tin removal

Package Includes:

• 1 x Fixture