-15%
Description
Premium-quality solder paste designed for BGA (Ball Grid Array) chips and electronic soldering on motherboards, with a focus on iPhone motherboard layer repairs. This low-temperature paste melts at 138°C, making it ideal for delicate rework, ensuring precise and reliable bonding without damaging sensitive components. Perfect for both professionals and hobbyists, it delivers consistent, high-performance results in BGA reballing, chip repairs, and multilayer PCB soldering applications.
