“YCS 2S CPU Heating Platform Magical Degumming Station for Cell Phone IC CPU Heating Glue Removal Solder Removal BGA Reball Tools” has been added to your cart. View cart
Mijing iRepair MS1 desoldering preheating platform for iPhone X-16 Pro Max motherboard CPU IC heating disassembly and glue removal. iRepair MS1 Soldering heating Station MS1-14/15 module for iPhone 14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max.
Features:
iRepair MS1 pre-heating station for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max /16/16 Plus/16 Pro/16 Pro Max motherboard soldering separating.
Newly upgraded heating element, fast heating, precise temperature control.
Added countdown function, layering and fitting are more secure.
iPhone X -16 Pro Max module + universal module + dot matrix module
Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Parameters:
Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station