Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max Middle Layer Motherboard

Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13/13 Mini/13 Pro/13 Pro Max Middle Layer Motherboard

Features:

• Mijing 4 in 1 BGA Reballing Stencil Platform for iPhone 13/ 13 Pro/ 13Pro Max/13Mini, convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 13 series BGA reballing and repairing

 

How to use:

• Install the main board on the platform

• Cover the BGA reballing stencil on the mainboard

• Evenly spread tin on the cover of the reballing stencil

• Remove the reballing stencil cover

• Take out the motherboard and cooperate with the hot air gun to solidify the tin point

 

Package includes:

• 1 x Fixture

• 4 x Steel mesh