YCS 2S CPU Heating Platform Magical Degumming Station for Cell Phone IC CPU Heating Glue Removal Solder Removal BGA Reball Tools
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“Mijing iRepair MS1 Intelligent Universal Desoldering Platform for iPhone X-17 Pro Max” has been added to your cart. View cart
YCS 2S CPU Heating Platform Magical Degumming Station for Cell Phone IC CPU Heating Glue Removal Solder Removal BGA Reball Tools
₹1,800.00 Original price was: ₹1,800.00.₹1,349.00Current price is: ₹1,349.00.
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Additional information
| Weight | 0.500 kg |
|---|---|
| Dimensions | 4 × 3 × 4 cm |
